- Patent Title: Wafer composite and method for producing a semiconductor component
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Application No.: US16264071Application Date: 2019-01-31
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Publication No.: US10784145B2Publication Date: 2020-09-22
- Inventor: Rudolf Berger , Wolfgang Lehnert , Gerhard Metzger-Brueckl , Guenther Ruhl , Roland Rupp
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@38d9f2f4
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/02 ; H01L21/304 ; H01L21/20 ; H01L21/78
Abstract:
A wafer composite is provided which includes an auxiliary substrate, a donor substrate and a sacrificial layer formed between the auxiliary substrate and the donor substrate. Functional elements of the semiconductor component are formed in a component layer, including at least one partial layer of the donor substrate. The auxiliary substrate is then separated from the component layer by heat input into the sacrificial layer.
Public/Granted literature
- US20190244853A1 Wafer Composite and Method for Producing a Semiconductor Component Public/Granted day:2019-08-08
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