Invention Grant
- Patent Title: BEOL embedded high density vertical resistor structure
-
Application No.: US16531846Application Date: 2019-08-05
-
Publication No.: US10784194B2Publication Date: 2020-09-22
- Inventor: Alexander Reznicek , Oscar van der Straten , Praneet Adusumilli
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L49/02 ; H01L21/768 ; H01L27/08
Abstract:
Embedded resistors which have tunable resistive values located between interconnect levels are provided. The embedded resistors have a pillar structure, i.e., they have a height that is greater than their width, thus they occupy less real estate as compared with conventional planar resistors that are typically employed in BEOL technology.
Public/Granted literature
- US20190355661A1 BEOL EMBEDDED HIGH DENSITY VERTICAL RESISTOR STRUCTURE Public/Granted day:2019-11-21
Information query
IPC分类:
