A semiconductor device package comprises a substrate, a first component, a second component, a package body and a conductive material. The substrate has a surface. The first component is on the surface of the substrate. The second component is on the surface of the substrate. The package body comprises a first portion, a second portion and a third portion. The first portion encapsulates the first component and has a side surface. The second portion encapsulates the second component and has a side surface. The third portion connects the first portion and the second portion and has a top surface. The side surface of the first portion, the side surface of the second portion and the top surface of the third portion define a space separating the side surface of the first portion from the side surface of the second portion. The conductive material is disposed in the space.