Invention Grant
- Patent Title: Semiconductor sensor chip, semiconductor sensor chip array, and ultrasound diagnostic apparatus
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Application No.: US16310828Application Date: 2017-06-20
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Publication No.: US10784231B2Publication Date: 2020-09-22
- Inventor: Yasuhiro Yoshimura , Akifumi Sako , Naoaki Yamashita , Tatsuya Nagata
- Applicant: HITACHI, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI, LTD.
- Current Assignee: HITACHI, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@662073ef
- International Application: PCT/JP2017/022614 WO 20170620
- International Announcement: WO2018/012214 WO 20180118
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L25/065 ; B06B1/02 ; H01L23/00

Abstract:
The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.
Public/Granted literature
- US20200098726A1 SEMICONDUCTOR SENSOR CHIP, SEMICONDUCTOR SENSOR CHIP ARRAY, AND ULTRASOUND DIAGNOSTIC APPARATUS Public/Granted day:2020-03-26
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