Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15345772Application Date: 2016-11-08
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Publication No.: US10784284B2Publication Date: 2020-09-22
- Inventor: Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@540ee42e
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H01L21/02 ; H01L21/768 ; H01L21/84 ; H01L23/522 ; H01L23/532 ; H01L29/66 ; H01L21/822 ; H01L21/8258

Abstract:
To provide a highly reliable semiconductor device that is suitable for miniaturization and an increase in density. The semiconductor device includes a first insulator over a substrate, a transistor including an oxide semiconductor over the first insulator, a second insulator over the transistor, and a third insulator over the second insulator. The first insulator and the third insulator have a barrier property with respect to oxygen and hydrogen. The second insulator includes an excess-oxygen region. The transistor is enclosed with the first insulator and the third insulator that are in contact with each other in an edge of a region where the transistor is positioned.
Public/Granted literature
- US20170141130A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-05-18
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