Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16044086Application Date: 2018-07-24
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Publication No.: US10784349B2Publication Date: 2020-09-22
- Inventor: Seigo Mori , Masatoshi Aketa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1e70ba5f
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/16 ; H01L29/66 ; H01L29/739 ; H01L29/08 ; H01L29/06 ; H01L29/10 ; H01L29/78 ; H01L27/04 ; H01L29/12 ; H01L27/07

Abstract:
A semiconductor device according to the present invention includes a semiconductor layer of SiC of a first conductivity type, a plurality of body regions of a second conductivity type formed in the surface portion of the semiconductor layer with each body region forming a unit cell, a source region of the first conductivity type formed in the inner portion of the body region, a gate electrode facing the body region across a gate insulating film, a drain region of the first conductivity type and a collector region of the second conductivity type formed in the rear surface portion of the semiconductor layer such that the drain region and the collector region adjoin each other, and a drift region between the body region and the drain region, wherein the collector region is formed such that the collector region covers a region including at least two unit cells in the x-axis direction along the surface of the semiconductor layer.
Public/Granted literature
- US20180331185A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-11-15
Information query
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