Invention Grant
- Patent Title: Package method of OLED element and OLED package structure
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Application No.: US15105573Application Date: 2016-04-26
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Publication No.: US10784468B2Publication Date: 2020-09-22
- Inventor: Jiajia Qian
- Applicant: TCL China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Leong C. Lei
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@165418e
- International Application: PCT/CN2016/080281 WO 20160426
- International Announcement: WO2017/156830 WO 20170921
- Main IPC: H01L51/56
- IPC: H01L51/56 ; H01L51/52 ; H01L27/32

Abstract:
The present invention provides a package method of an OLED element and an OLED package structure. In the package method of the OLED element, according to the present invention, by manufacturing a circle of the retaining wall at the periphery of the OLED element, and then forming the laminated film covering the OLED element in the region surrounded by the retaining wall, and the laminated film comprises the few first barrier layers and the few buffer layers which are alternately stacking, and ultimately, forming the second barrier layer which completely covers the buffer layer and the top of the retaining wall on the outermost buffer layer of the laminated film, the OLED package structure of extremely strong sealing can be obtained. In the package method, a protective shield of extremely strong sealing for the OLED element is formed with the retaining wall and the outermost second barrier layer.
Public/Granted literature
- US20180102505A1 PACKAGE METHOD OF OLED ELEMENT AND OLED PACKAGE STRUCTURE Public/Granted day:2018-04-12
Information query
IPC分类: