Invention Grant
- Patent Title: High power radio frequency amplifiers and methods of manufacture thereof
-
Application No.: US16226341Application Date: 2018-12-19
-
Publication No.: US10784822B2Publication Date: 2020-09-22
- Inventor: Ning Zhu , Jeffrey Spencer Roberts , Damon G. Holmes
- Applicant: NXP USA, INC.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H03F1/56
- IPC: H03F1/56 ; H03F3/217 ; H03F3/193 ; H01L29/20 ; H01L23/66 ; H01L21/48 ; H01L23/00 ; H01L23/495 ; H01L29/778

Abstract:
The embodiments described herein provide radio frequency (RF) amplifiers, and in some embodiments provide amplifiers that can be used in high power RF applications. Specifically, the amplifiers described herein may be implemented with multiple resonant circuits to provide class F and inverse class F amplifiers and methods of operation. In general, the resonant circuits are implemented inside a device package with a transistor die to provide high efficiency amplification for a variety of applications.
Information query