Invention Grant
- Patent Title: Ultra-high speed digital-to-analog (DAC) conversion methods and apparatus having sub-DAC systems for data interleaving and power combiner with no interleaving
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Application No.: US16623755Application Date: 2018-07-05
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Publication No.: US10784880B2Publication Date: 2020-09-22
- Inventor: Ark-Chew Wong , Richard Dennis Alexander , Craig A. Hornbuckle
- Applicant: Jariet Technologies, Inc.
- Applicant Address: US CA Redondo Beach
- Assignee: Jariet Technologies, Inc.
- Current Assignee: Jariet Technologies, Inc.
- Current Assignee Address: US CA Redondo Beach
- Agency: Morgan, Lewis & Bockius LLP
- International Application: PCT/US2018/040881 WO 20180705
- International Announcement: WO2019/010280 WO 20190110
- Main IPC: H03M1/66
- IPC: H03M1/66 ; H03M1/06 ; H03M1/74 ; H03M1/00

Abstract:
A ultra-high speed DAC apparatus (e.g., with a full sampling frequency not less than 20 GHz) may include one or more digital pre-coders and DAC modules. Each DAC module may include multiple current-mode DAC systems and a first power combiner. The gate length of transistors within each DAC module may be between 6 and 40 nm. Each current-mode DAC system includes a transmission line (e.g., 40 to 80 microns long) coupled to multiple interleaving sub-DAC systems (within the current-mode DAC systems) and the first power combiner. The first power combiner combines, without interleaving, analog signals that have been interleaved within the current-mode DAC systems. The impedance of the first power combiner matches the impedance of each of the current-mode DAC systems and a load of the first power combiner. A second power combiner combines, without interleaving, analog signals from the DAC modules.
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