Invention Grant
- Patent Title: Heat dissipation module and electronic device
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Application No.: US16403616Application Date: 2019-05-06
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Publication No.: US10785893B1Publication Date: 2020-09-22
- Inventor: Chih-Yao Kuo , Chin-Kai Sun , Chun-Lung Chu , Wei-Cheng Liu
- Applicant: HTC Corporation
- Applicant Address: TW Taoyuan
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan
- Agency: JCIPRNET
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14 ; H05K1/18 ; H05K5/03

Abstract:
A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member, and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a fourth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.
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