Invention Grant
- Patent Title: Housing structure and manufacturing method thereof
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Application No.: US16423998Application Date: 2019-05-28
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Publication No.: US10791642B2Publication Date: 2020-09-29
- Inventor: Hsiang-Mei Chiang , Wei-Chiang Huang , Jia-Hung Lin
- Applicant: Primax Electronics Ltd.
- Applicant Address: TW Taipei
- Assignee: PRIMAX ELECTRONICS LTD.
- Current Assignee: PRIMAX ELECTRONICS LTD.
- Current Assignee Address: TW Taipei
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@72948cad
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/02 ; B23K103/00 ; B23K26/40 ; B23K26/364

Abstract:
A housing structure for an electronic device includes a light-transmissible housing body, a first light-shielding layer, a second light-shielding layer, a protective layer and an engraved trench. The first light-shielding layer is formed on a second surface of the light-transmissible housing body. The engraved trench is formed in the second surface of the light-transmissible housing body and not covered by the first light-shielding layer. The second light-shielding layer is formed on a first surface of the light-transmissible housing body. The protective layer is formed over the second light-shielding layer. A pattern corresponding to the engraved trench is visible.
Public/Granted literature
- US20200267860A1 HOUSING STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-08-20
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