Housing structure and manufacturing method thereof
Abstract:
A housing structure for an electronic device includes a light-transmissible housing body, a first light-shielding layer, a second light-shielding layer, a protective layer and an engraved trench. The first light-shielding layer is formed on a second surface of the light-transmissible housing body. The engraved trench is formed in the second surface of the light-transmissible housing body and not covered by the first light-shielding layer. The second light-shielding layer is formed on a first surface of the light-transmissible housing body. The protective layer is formed over the second light-shielding layer. A pattern corresponding to the engraved trench is visible.
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