Interspinous process spacing devices and associated methods are provided. In one embodiment, an interspinous process spacing device includes a first attachment side, a second attachment side, and a spacer. The first attachment side and the second attachment side each include a central portion, a first wing portion, and a second wing portion. The central portion includes an inner surface extending along at least a majority of an anterior-posterior height of the central portion, and the first wing portion includes an inner surface extending along at least a majority of an anterior-posterior height of the first wing portion. The inner surface of the first wing portion extends in a direction transverse to the inner surface of the central portion, and the anterior-posterior height of the first wing portion is less than the anterior-posterior height of the central portion.