The present invention relates to a method for curing adhesives used in the manufacture of membrane modules containing polymeric membranes, particularly polyimide based membranes used for the nanofiltration or ultrafiltration of solutes dissolved in organic solvents using microwaves. To maximise the chemical resistance of the adhesive used in these organic solvent applications, it must be as fully reacted and crosslinked (“cured”) as possible. Typically, thermal processing (heating) of the entire membrane module is used to cure the adhesives. However, the time and temperature required to achieve this high degree of completion of reaction may damage the separation performance of the membrane contained within the membrane module. In one particular aspect, this process utilises microwaves to preferentially promote the curing of epoxy adhesives over the general heating of the membrane module.