A continuous casting mold according to the present invention has plural separate portions filled with a metal of low thermal conductivity formed by filling a metal having a thermal conductivity of 30% or less of that of copper into circular concave grooves having a diameter of 2 to 20 mm which are formed in the region of the inner wall surface of the copper mold from an arbitrary position higher than a meniscus to a position 20 mm or more lower than the meniscus, in which the filling thickness of the metal in the portions filled with the metal of low thermal conductivity is equal to or less than the depth of the circular concave grooves and satisfies the relationship with the diameter of the portions filled with the metal of low thermal conductivity expressed by expression (1) below: 0.5≤H≤d  (1).