Invention Grant
- Patent Title: Solder processing device
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Application No.: US15558562Application Date: 2016-03-15
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Publication No.: US10792747B2Publication Date: 2020-10-06
- Inventor: Mitsuo Ebisawa
- Applicant: AND Co., Ltd.
- Applicant Address: JP Souraku-gun
- Assignee: AND Co., Ltd.
- Current Assignee: AND Co., Ltd.
- Current Assignee Address: JP Souraku-gun
- Agency: Metrolex IP Law Group, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@22408265
- International Application: PCT/JP2016/058086 WO 20160315
- International Announcement: WO2016/147126 WO 20160922
- Main IPC: B23K3/06
- IPC: B23K3/06 ; H05K3/34 ; B23K1/00 ; B23K3/03 ; B23K3/02 ; B23K101/42

Abstract:
A substantially tubular iron tip (5) that can be heated and that is extended vertically and a solder piece supply portion that supplies a first solder piece (Wh1) and a second solder piece (Wh2) in which a layer of a flux (72) is provided within a tubular solder layer in this order from above into the iron tip are provided, within the iron tip, the solder pieces are erected such that on the first solder piece, the second solder piece rides and the heat of the iron tip is used to melt the first solder piece and the second solder piece such that the molten solder is supplied downward. In this way, it is possible to more reliably heat and melt the solder pieces in a posture in which they are erected within the iron tip.
Public/Granted literature
- US20180056423A1 SOLDER PROCESSING DEVICE Public/Granted day:2018-03-01
Information query
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