Invention Grant
- Patent Title: Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
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Application No.: US15615591Application Date: 2017-06-06
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Publication No.: US10792785B2Publication Date: 2020-10-06
- Inventor: Ke Zhang
- Applicant: Cabot Microelectronics Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Erika S. Wilson; Daniel C. Schulte
- Main IPC: B24B37/04
- IPC: B24B37/04 ; C09K3/14 ; C09G1/02
Abstract:
Described are slurry compositions useful in chemical-mechanical processing of a nickel layer of a substrate, wherein the slurry compositions contain abrasive particles that include silica particles that are cationically charged at a low pH.
Public/Granted literature
- US20170348820A1 CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS FOR PROCESSING A NICKEL SUBSTRATE SURFACE Public/Granted day:2017-12-07
Information query
