Invention Grant
- Patent Title: Lamination molding apparatus
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Application No.: US16578415Application Date: 2019-09-23
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Publication No.: US10792864B2Publication Date: 2020-10-06
- Inventor: Shuji Okazaki , Tsuyoshi Saito
- Applicant: SODICK CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: SODICK CO., LTD.
- Current Assignee: SODICK CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6d116e8e
- Main IPC: B29C67/00
- IPC: B29C67/00 ; B29C64/357 ; B33Y30/00 ; B29C64/227 ; B29C64/245 ; B33Y40/00

Abstract:
A lamination molding apparatus includes a table, powder holding walls, a table driving device, a bucket, and a cover. The powder holding walls surround the table and hold material powder together with the table. The table driving device includes a linear actuator for outputting linear motion and a guide for transmitting the linear motion to the table and moving the table in a vertical direction. The bucket is disposed under the table and stores the material powder falling from between the table and the powder holding walls. The cover surrounds the table driving device between the table and the bucket. At least one portion of the linear actuator and the guide surrounded by the cover or the bucket is arranged along the vertical direction.
Public/Granted literature
- US20200101669A1 LAMINATION MOLDING APPARATUS Public/Granted day:2020-04-02
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