Invention Grant
- Patent Title: Tableting punch or die and tableting machine including the same
-
Application No.: US16093555Application Date: 2016-11-18
-
Publication No.: US10792880B2Publication Date: 2020-10-06
- Inventor: Kenji Ogata , Daisuke Higashi
- Applicant: TOWA Corporation
- Applicant Address: JP Kyoto
- Assignee: Towa Corporation
- Current Assignee: Towa Corporation
- Current Assignee Address: JP Kyoto
- Agency: Procopio Cory Hargreaves and Savitch LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@26e069a5
- International Application: PCT/JP2016/084238 WO 20161118
- International Announcement: WO2017/179235 WO 20171019
- Main IPC: B29C33/56
- IPC: B29C33/56 ; B30B11/02 ; A61J3/10 ; C23C14/08
Abstract:
A tableting punch or a die includes a base material and a tableting surface layer on the base material. The tableting surface layer includes crystalline yttrium oxide containing nitrogen and a group 4A element.
Public/Granted literature
- US20190176428A1 TABLETING PUNCH OR DIE AND TABLETING MACHINE INCLUDING THE SAME Public/Granted day:2019-06-13
Information query
