- Patent Title: Bridged silicone resin, film, electronic device and related methods
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Application No.: US16336759Application Date: 2017-09-29
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Publication No.: US10793680B2Publication Date: 2020-10-06
- Inventor: Peng-Fei Fu
- Applicant: DOW SILICONES CORPORATION
- Applicant Address: US MI Midland
- Assignee: Dow Silicones Corporation
- Current Assignee: Dow Silicones Corporation
- Current Assignee Address: US MI Midland
- Agency: Warner Norcross + Judd LLP
- International Application: PCT/US2017/054435 WO 20170929
- International Announcement: WO2018/064543 WO 20180405
- Main IPC: C08G77/52
- IPC: C08G77/52 ; C08G77/12 ; C08J5/18 ; H01B3/46 ; C09D183/14 ; C08G77/00
Abstract:
A bridged silicone resin is disclosed which has the general formula (1): (HSiO3/2)x(SiO3/2—X—SiO3/2)y(1); wherein x and y are each from >0 to
Public/Granted literature
- US20200172679A1 BRIDGED SILICONE RESIN, FILM, ELECTRONIC DEVICE AND RELATED METHODS Public/Granted day:2020-06-04
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