Invention Grant
- Patent Title: Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same
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Application No.: US16301509Application Date: 2017-02-15
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Publication No.: US10793711B2Publication Date: 2020-10-06
- Inventor: Yoon Man Lee , Jae Hyun Kim , Tae Shin Eom , Eun Jung Lee , Su Mi Im
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-si, Gyeonggi-do
- Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Yongin-si, Gyeonggi-do
- Agency: Lee IP Law, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@21f71cd0
- International Application: PCT/KR2017/001662 WO 20170215
- International Announcement: WO2017/217638 WO 20171221
- Main IPC: C08J3/12
- IPC: C08J3/12 ; C08L63/00 ; C08K3/36 ; H01L23/29 ; H01L33/56 ; C08J3/20 ; C08G59/02
Abstract:
The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.
Public/Granted literature
- US20190292363A1 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED USING SAME Public/Granted day:2019-09-26
Information query
