Disclosed is a hot melt adhesive comprising: (A) a thermoplastic block copolymer which is a block copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound; and (B) an amorphous wax modified with a carboxylic acid and/or a carboxylic anhydride. The hot melt adhesive is excellent in applicability at a low temperature near from about 140° C. to about 150° C. and excellent in creep resistance in a wet state, can reduce odor, is excellent in initial adhesive force, and is excellent in adhesive property (peel strength) to an olefin substrate. This hot melt adhesive can be used suitably so as to produce a disposable product.