Invention Grant
- Patent Title: Adhesive sheet and electronic device
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Application No.: US15124471Application Date: 2015-03-12
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Publication No.: US10793755B2Publication Date: 2020-10-06
- Inventor: Takeshi Iwasaki , Yumi Kagiyama , Hideaki Takei , Yuya Kitade , Yuki Komatsuzaki , Tsunenori Hashiguchi
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC CORPORATION
- Current Assignee: DIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@12dfb5de com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@436c5686 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@14230f6c
- International Application: PCT/JP2015/057281 WO 20150312
- International Announcement: WO2015/137437 WO 20150917
- Main IPC: C09J133/08
- IPC: C09J133/08 ; C09J133/00 ; C09J7/20 ; C09J7/26 ; C08K5/01 ; C08K5/13 ; C08K5/134 ; C09J133/06 ; C08K5/00

Abstract:
An object to be achieved by the present invention is to provide an industrially useful adhesive sheet that can be used to bond various adherends and has excellent peel adhesion, excellent push strength, and excellent holding power under static load. The object of the present invention can be achieved by an adhesive sheet having, on one side or both side of a substrate, an adhesive layer (A) having a tensile strength of 6 N/cm2 or more as determined from a stress-strain curve (a so-called S-S curve) at a strain of 100%.
Public/Granted literature
- US20170015872A1 ADHESIVE SHEET AND ELECTRONIC DEVICE Public/Granted day:2017-01-19
Information query
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