Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method using the same
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Application No.: US15289903Application Date: 2016-10-10
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Publication No.: US10793949B2Publication Date: 2020-10-06
- Inventor: Jun Jin Hyon , Sung Tae Je , Byoung Gyu Song , Yong Ki Kim , Kyong Hun Kim , Chang Dol Kim , Yang Sik Shin , Jae Woo Kim
- Applicant: EUGENE TECHNOLOGY CO., LTD.
- Applicant Address: KR
- Assignee: EUGENE TECHNOLOGY CO., LTD.
- Current Assignee: EUGENE TECHNOLOGY CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2320e30d
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/44 ; C23C16/458 ; H01L21/67 ; H01L21/677 ; H01L21/687 ; H01L21/02 ; H01L21/673

Abstract:
The present disclosure relates to a substrate processing apparatus and a substrate processing method using the same, and more particularly, to a substrate processing apparatus that is capable of improving a flow of a process gas that is participated in a substrate processing process and a substrate processing method using the same. The substrate processing apparatus in accordance with an exemplary embodiment includes a pre-chamber into a substrate is carried, a process chamber communicating with the pre-chamber and in which a substrate processing process is performed, a substrate boat including a plurality of partition plates that partition a loading space into which the substrate is loaded and to elevate, a gas supply unit configured to supply a process gas to the substrate through a plurality of injection nozzles provided in the process chamber, an exhaust unit configured to exhaust a gas through a plurality of suction holes defined in the process chamber, and a swap guide member provided in the pre-chamber and configured to place the substrate carried into the pre-chamber in the loading space that is partitioned by the plurality of partition plates.
Public/Granted literature
- US20170137938A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME Public/Granted day:2017-05-18
Information query
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