Invention Grant
- Patent Title: Passivating fissures in substrates
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Application No.: US16616867Application Date: 2018-12-11
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Publication No.: US10793963B2Publication Date: 2020-10-06
- Inventor: Hayden Black
- Applicant: ILLUMINA, INC.
- Applicant Address: US CA San Diego
- Assignee: ILLUMINA, INC.
- Current Assignee: ILLUMINA, INC.
- Current Assignee Address: US CA San Diego
- Agency: Illumina, Inc.
- International Application: PCT/US2018/064889 WO 20181211
- International Announcement: WO2019/125822 WO 20190627
- Main IPC: C25D9/02
- IPC: C25D9/02 ; B01L3/00 ; G01N27/414

Abstract:
Provided in one example is a sensor having at least one fissure, the fissure being at least partially filled by at least one polymer formation extending vertically within a passivation layer. The polymer formation protects the underlying metal containing layer from corrosive solutions. Provided in another example is a method of forming the polymer formation in a fissure of a sensor.
Public/Granted literature
- US20200102665A1 Passivating Fissures in Substrates Public/Granted day:2020-04-02
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