Invention Grant
- Patent Title: Connection assembly
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Application No.: US16278743Application Date: 2019-02-19
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Publication No.: US10794413B2Publication Date: 2020-10-06
- Inventor: Chia-Fu Chen
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: CKC & Partners Co., LLC
- Main IPC: F16B9/00
- IPC: F16B9/00 ; F16J15/02

Abstract:
A connection assembly includes a housing, an adaptor and a conducting element. The housing has a chamber and an opening communicating with the chamber. The adaptor has a first through hole. The adaptor is at least partially connected outside the housing. The opening communicates with the first through hole. The conducting element penetrates through the first through hole and the opening. The conducting element is detachably connected with the adaptor.
Public/Granted literature
- US20200173476A1 CONNECTION ASSEMBLY Public/Granted day:2020-06-04
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