Invention Grant
- Patent Title: Cooling structure and mounting structure
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Application No.: US16291074Application Date: 2019-03-04
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Publication No.: US10794639B2Publication Date: 2020-10-06
- Inventor: Makoto Fushimi
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@31c94b4e
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K7/02 ; H01L23/34 ; H01L23/36 ; H01L23/433 ; H01L23/473 ; F28F7/00 ; F28F13/00 ; F28F3/06 ; H05K1/02 ; F28F3/02 ; H05K1/18

Abstract:
A cooling structure includes a plurality of heat radiation parts configured to cool a heat generating component and a holding member configured to hold the plurality of heat radiation parts. Moreover, the heat radiation parts of the cooling structure each include a base portion located on the side of the heat generating component and a fin portion extending from the base portion and radiating heat. Furthermore, the base portions of the heat radiation parts abut on each other.
Public/Granted literature
- US20190285362A1 COOLING STRUCTURE AND MOUNTING STRUCTURE Public/Granted day:2019-09-19
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