Invention Grant
- Patent Title: Acoustic measurement of fabrication equipment clearance
-
Application No.: US14942402Application Date: 2015-11-16
-
Publication No.: US10794872B2Publication Date: 2020-10-06
- Inventor: Jun-Hao Deng , Kuan-Wen Lin , Sheng-Chi Chin , Yu-Ching Lee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G01N29/44
- IPC: G01N29/44 ; B08B13/00 ; G01B17/00 ; G01B21/16 ; B08B3/04 ; B08B5/02 ; H01L21/02 ; H01L21/288 ; H01L21/67 ; H01L21/66

Abstract:
A system and method for determining clearance between a fabrication tool and a workpiece is provided. In an exemplary embodiment, the method includes receiving a substrate within a tool such that a gap is defined there between. A transducer disposed on a bottom surface of the substrate opposite the gap provides an acoustic signal that is conducted through the substrate. The transducer also receives a first echo from a top surface of the substrate that defines the gap and a second echo from a bottom surface of the tool that further defines the gap. A width of the gap is measured based on the first echo and the second echo. In some embodiments, the bottom surface of the tool is a bottom surface of a nozzle, and the nozzle provides a liquid or a gas in the gap while the transducer is receiving the first and second echoes.
Public/Granted literature
- US20170138911A1 Acoustic Measurement of Fabrication Equipment Clearance Public/Granted day:2017-05-18
Information query