A power consuming electronics device that dissipates internal device heat via a heat sink is disclosed. The power consuming electronics device includes first and second complementary housing parts. The first housing part includes a first surface ending at a first peripheral edge, and the second housing part including a second surface ending at a second peripheral edge. The power consuming electronics device also includes a heat sink having an air exposed surface that is interposed between the first and second peripheral edges. Surface edges of the air exposed surface abut the first and second peripheral edges of the housing parts and are respectively matched therewith in shape and dimension so that an overall composite surface formed by the first and second surfaces of the housing parts and the air exposed surface of the heat sink is substantially continuous and uniform.