Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method, and storage medium
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Application No.: US16521052Application Date: 2019-07-24
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Publication No.: US10795265B2Publication Date: 2020-10-06
- Inventor: Norihisa Koga , Yoshitaka Konishi , Naruaki Iida , Yuzo Ohishi , Kazuhiro Takeshita
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2824574c
- Main IPC: G03B27/42
- IPC: G03B27/42 ; G03F7/20 ; G03F7/40
Abstract:
There is provided a substrate processing apparatus including: a light radiator configured to radiate a light for processing into an irradiation area which is smaller than a processing target area of a surface of a substrate; a driver configured to move the irradiation area in two directions that cross each other in a plane along the surface of the substrate; and a controller configured to control the driver to move an irradiation position in two directions according to a movement pattern which has been set to radiate the light to an entire area of the processing target area.
Public/Granted literature
- US20200041913A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM Public/Granted day:2020-02-06
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