Invention Grant
- Patent Title: Coil electronic component
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Application No.: US16004110Application Date: 2018-06-08
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Publication No.: US10796829B2Publication Date: 2020-10-06
- Inventor: Jung Ho Cho
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3d742959
- Main IPC: H01F1/34
- IPC: H01F1/34 ; H01F27/32 ; H01F41/12 ; H01F27/28 ; H01F41/04 ; B22F5/00 ; B22F7/00 ; C22C30/06 ; C22C30/02 ; C22C38/16 ; C22C38/08 ; C22C38/00 ; H01F27/29 ; B22F3/10 ; H01F17/00 ; B22F5/10 ; C22C33/02

Abstract:
A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on an external surface of the body and connected to the coil patterns. The plurality of insulating layers include a Ni—Cu—Zn based ferrite, and the Ni—Cu—Zn based ferrite has a content of Ni within a range from 5 to 15%, a content of Cu within a range from 5 to 10%, and a content of Zn within a range from 28 to 35% based on a mole ratio.
Public/Granted literature
- US20190122794A1 COIL ELECTRONIC COMPONENT Public/Granted day:2019-04-25
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