Invention Grant
- Patent Title: Coil component
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Application No.: US16027947Application Date: 2018-07-05
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Publication No.: US10796840B2Publication Date: 2020-10-06
- Inventor: Joung Gul Ryu , Boum Seock Kim , Kang Wook Bong , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4cc40179
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/06 ; H01F27/28 ; H01F27/255 ; H01F27/29 ; H01F17/00 ; H01F17/04

Abstract:
A coil component includes: a body including a support member, a coil, and a magnetic material; and external electrodes disposed on an external surface of the body. The coil may include first and second coils supported by one surface and the other surface of the support member, respectively, and the first and second coils may include first and second seed patterns, respectively. A thickness of the first seed pattern may be thinner than that of the second seed pattern. Warpage properties of the first support member adjacent to the first seed pattern may be greater than those of the second support member adjacent to the second seed pattern.
Public/Granted literature
- US20190180905A1 COIL COMPONENT Public/Granted day:2019-06-13
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