Invention Grant
- Patent Title: Multilayer capacitor
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Application No.: US16184337Application Date: 2018-11-08
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Publication No.: US10796855B2Publication Date: 2020-10-06
- Inventor: Sung Hyung Kang , Yong Koo Kim , Hyung Kyu Kim , Won Hee Yoo , Jong Hyun Cho , Byung Kil Yun , Seok Kyoon Woo , Hyun Sung Dong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@18c5cb56
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/248 ; H01G4/30 ; H01G4/008 ; H01G4/12

Abstract:
A multilayer capacitor includes a body, including a stacked structure formed of a plurality of dielectric layers and a plurality of internal electrodes, and a plurality of external electrodes. Each external electrode includes a conductive layer, disposed at the end of the body and connected to the plurality of internal electrodes, and a plating layer covering the conductive layer. Each conductive layer includes nickel (Ni) and barium titanate (BT), and an area occupied by nickel with respect to the total area of the respective conductive layer is 30% to 65%.
Public/Granted literature
- US20200058443A1 MULTILAYER CAPACITOR Public/Granted day:2020-02-20
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