Invention Grant
- Patent Title: Supercritical fluid producing apparatus and substrate processing apparatus
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Application No.: US15828636Application Date: 2017-12-01
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Publication No.: US10796897B2Publication Date: 2020-10-06
- Inventor: Yasuo Kiyohara
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@479767f5
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B01D11/04 ; F26B5/00 ; H01L21/67

Abstract:
A supercritical fluid producing apparatus according to the present disclosure includes a gas supply line, a cooler, a pump, a buffer tank, a heating device, and a supercritical fluid supply line. An inlet port into which a processing fluid from the pump flows is formed at a predetermined position on the buffer tank, and an outlet port through which the processing fluid flows out is formed at a different position from the inlet port. The buffer tank includes a buffer tank body that stores the processing fluid from the pump, and a heater that heats the processing fluid sent into the buffer tank body.
Public/Granted literature
- US20180158676A1 SUPERCRITICAL FLUID PRODUCING APPARATUS AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2018-06-07
Information query
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