A semiconductor device package includes a substrate having a first surface and a second surface facing away from the first surface, a conductive column extending in the substrate between the first surface and the second surface, a dielectric layer on the first surface of the substrate, a redistribution structure provided in the dielectric layer and electrically connected to the conductive column, a semiconductor chip provided above the dielectric layer and electrically connected to the redistribution structure, and an encapsulation layer on the dielectric layer and encapsulating the semiconductor chip. The package is manufactured such that each of the substrate and the encapsulation layer is formed of molding compound.