A manufacturing method of a package structure is described. The method includes at least the following steps. A carrier is provided. A semiconductor die and a sacrificial structure are disposed on the carrier. The semiconductor die is electrically connected to the bonding pads on the sacrificial structure through a plurality of conductive wires. As encapsulant is formed on the carrier to encapsulate the semiconductor die, the sacrificial structure and the conductive wires. The carrier is debonded, and at least a portion of the sacrificial structure is removed through a thinning process. A redistribution layer is formed on the semiconductor die and the encapsulant. The redistribution layer is electrically connected to the semiconductor die through the conductive wires.