Invention Grant
- Patent Title: Equipment front end module
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Application No.: US16296423Application Date: 2019-03-08
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Publication No.: US10796937B2Publication Date: 2020-10-06
- Inventor: June Phil Yoon , Jae Won Jang
- Applicant: CLEAN FACTOMATION, INC.
- Applicant Address: KR Gyeonggi-Do
- Assignee: CLEAN FACTOMATION, INC.
- Current Assignee: CLEAN FACTOMATION, INC.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Davis & Bujold PLLC
- Agent Michael J. Bujold
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3933644
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/673 ; H01L21/67

Abstract:
Disclosed herein is an equipment front end module (EFEM) including: a transfer chamber; a load port module on which a wafer receiving container is seated; a wafer transfer robot positioned in the transfer chamber and configured to transfer a wafer in the wafer receiving container seated on the load port module toward a process equipment side; and a buffer module configured to store the wafer receiving container before or after the seating of the wafer receiving container on the load port module and inject an inert gas into the FOUP to purge the wafer.
Public/Granted literature
- US20200105561A1 EQUIPMENT FRONT END MODULE Public/Granted day:2020-04-02
Information query
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