Invention Grant
- Patent Title: Transistor structure
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Application No.: US16428651Application Date: 2019-05-31
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Publication No.: US10796964B2Publication Date: 2020-10-06
- Inventor: Shih-Yin Hsiao , Ching-Chung Yang , Kuan-Liang Liu
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@59a3af9a
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/02 ; H01L21/8249 ; H01L21/8234 ; H01L29/49 ; H01L29/78 ; H01L29/423

Abstract:
A transistor structure includes a source region and a drain region disposed in a substrate, extending along a first direction. A polysilicon layer is disposed over the substrate, extending along a second direction perpendicular to the first direction, wherein the polysilicon layer includes a first edge region, a channel region and a second edge region formed as a gate region between the source region and the drain region in a plane view. The polysilicon layer has at least a first opening pattern at the first edge region having a first portion overlapping with the gate region; and at least a second opening pattern at the second edge region having a second portion overlapping with the gate region.
Public/Granted literature
- US20190287860A1 TRANSISTOR STRUCTURE Public/Granted day:2019-09-19
Information query
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