Invention Grant
- Patent Title: TIM strain mitigation in electronic modules
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Application No.: US16285378Application Date: 2019-02-26
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Publication No.: US10796978B2Publication Date: 2020-10-06
- Inventor: Gerard McVicker , Sri M. Sri-Jayantha
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group, PLLC
- Agent L. Jeffrey Kelly, Esq.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/367 ; H01L23/04 ; H01L23/42
Abstract:
A heat spreading lid, including a lid body, a wing portion, where the wing portion flexibly moves independently from the lid body.
Public/Granted literature
- US20190206762A1 TIM STRAIN MITIGATION IN ELECTRONIC MODULES Public/Granted day:2019-07-04
Information query
IPC分类:
