To reduce a package size of a semiconductor device.According to embodiments, there is a semiconductor device comprising: a first die pad; a first inner lead arranged inside a molded resin; a second die pad; and a second inner lead arranged inside the resin, wherein a part of the first inner lead and a part of the second inner lead are adhered and electrically connected to each other, a first semiconductor chip mounted on the first die pad is electrically connected to a second semiconductor chip mounted on the second die pad via the first inner lead and the second inner lead, and an end face of one end of the first inner lead and the second inner lead that are adhered to each other is exposed to a side surface of the resin.