Invention Grant
- Patent Title: Semiconductor package having a metal barrier
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Application No.: US15859231Application Date: 2017-12-29
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Publication No.: US10797010B2Publication Date: 2020-10-06
- Inventor: Joel Tomas Medina , Armando Tresvalles Clarina, Jr. , Jay-Ar Tumaru Flores , Ruby Ann Dizon Mamangun
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A semiconductor device having a barrier metal layer positioned over a metallization layer, and an under bump metallurgy layer over the barrier metal layer, and a solder bump over the under bump metallurgy layer.
Public/Granted literature
- US20190206817A1 SEMICONDUCTOR PACKAGE HAVING A METAL BARRIER Public/Granted day:2019-07-04
Information query
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