- Patent Title: Acrylic resin composition for sealing, cured product of same, method for producing same, semiconductor device using said resin composition, and method for manufacturing said semiconductor device
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Application No.: US15547965Application Date: 2016-01-19
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Publication No.: US10797013B2Publication Date: 2020-10-06
- Inventor: Jin Jin , Naoki Kanagawa , Shigeru Yamatsu , Daisuke Sasaki , Kazuki Watanabe
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@772bda2c
- International Application: PCT/JP2016/000232 WO 20160119
- International Announcement: WO2016/132671 WO 20160825
- Main IPC: H01L23/00
- IPC: H01L23/00 ; C08L33/06 ; C09D133/06 ; C08K9/06 ; H01L21/56 ; C08K3/22 ; C08K5/14 ; C08K5/5435 ; C08L33/08 ; C08L63/00 ; H01L21/48 ; H01L21/50 ; C08K3/013 ; C08L33/10 ; C08K3/28 ; H01L21/60
Abstract:
A sealing acrylic resin composition contains a thermosetting acrylic resin in liquid phase, an organic peroxide, and an inorganic filler in a content proportion ranging from 50% by mass to 95% by mass, inclusive. A silane coupling agent is bonded to the inorganic filler, a total organic carbon content of the inorganic filler in proportion being ranging from 0.1% by mass to 1.0% by mass, inclusive, in a state before the inorganic filler is mixed with at least one of the thermosetting acrylic resin and the organic peroxide. The silane coupling agent has an acrylic group.
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