Invention Grant
- Patent Title: Light-emitting element module
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Application No.: US16371727Application Date: 2019-04-01
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Publication No.: US10797032B2Publication Date: 2020-10-06
- Inventor: Yuta Ikawa , Hiroyoshi Higashisaka , Tsuyoshi Ono , Keiichi Sawai
- Applicant: SHARP KABUSHIKI KAISHA
- Applicant Address: JP Sakai, Osaka
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Sakai, Osaka
- Agency: ScienBiziP, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2d9643af
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L33/62 ; H01L25/075 ; H01L23/522 ; H01L33/60 ; H01L33/64 ; H01L49/02 ; H01L23/528

Abstract:
In a light-emitting element module, at least two or more first electrodes of a first substrate that includes a circuit element are joined to at least two or more light-emitting elements. The first substrate includes a first wiring line to an n-th wiring line (n is an integer of 2 or more) that are formed into layers in order from the at least two or more light-emitting elements in a thickness direction of the first substrate. The first wiring line that is located in one of the layers of the first substrate nearest to the at least two or more light-emitting elements is formed at least in an interelectrode region between the adjacent first electrodes of the first substrate in a plan view.
Public/Granted literature
- US20190333902A1 LIGHT-EMITTING ELEMENT MODULE Public/Granted day:2019-10-31
Information query
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