Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16281202Application Date: 2019-02-21
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Publication No.: US10797072B2Publication Date: 2020-10-06
- Inventor: Takuya Inatsuka , Taichi Iwasaki , Osamu Matsuura
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3a60c11a
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L29/36 ; H01L29/08 ; H01L29/10 ; H01L29/49 ; H01L29/04 ; H01L27/11573 ; H01L27/11565 ; H01L27/11568 ; H01L29/51 ; H01L29/167 ; H01L21/02 ; H01L21/266 ; H01L21/265 ; H01L21/027 ; H01L21/324 ; H01L21/311

Abstract:
A semiconductor device according to an embodiment includes an N-well region, a first gate electrode, a columnar epitaxial layer, and a first contact. The N-well region includes two P-type impurity diffusion regions. The first gate electrode is provided above the N-well region between the two P-type impurity diffusion regions. The first gate electrode are opposed to the N-well region via a gate insulating film. The columnar epitaxial layer is provided on the P-type impurity diffusion region. The epitaxial layer includes a first semiconductor layer including P-type impurities. The first contact is provided on the first semiconductor layer of the epitaxial layer.
Public/Granted literature
- US20200083246A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-03-12
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