Invention Grant
- Patent Title: Semiconductor devices and method of forming the same
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Application No.: US15914113Application Date: 2018-03-07
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Publication No.: US10797143B2Publication Date: 2020-10-06
- Inventor: Keun Lee , Jeong Gil Lee , Do Hyung Kim , Ki Hyun Yoon , Hyun Seok Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7af165db
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/1157 ; H01L27/11582 ; H01L29/49 ; H01L21/28 ; G11C16/08 ; G11C16/04

Abstract:
Semiconductor devices and methods of forming the same are provided. Semiconductor devices may include a plurality of gate electrodes that are stacked on a substrate and are spaced apart from each other in a vertical direction and a channel region extending through the plurality of gate electrodes in the vertical direction. Each of the plurality of gate electrodes may include a first conductive layer defining a recess recessed toward the channel region, and a second conductive layer in the recess defined by the first conductive layer. A first concentration of impurities in the second conductive layer may be higher than a second concentration of the impurities in the first conductive layer, and the impurities may include nitrogen (N).
Public/Granted literature
- US20190067429A1 SEMICONDUCTOR DEVICES AND METHOD OF FORMING THE SAME Public/Granted day:2019-02-28
Information query
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