Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16591171Application Date: 2019-10-02
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Publication No.: US10797145B2Publication Date: 2020-10-06
- Inventor: Yuki Nakano , Ryota Nakamura , Katsuhisa Nagao
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agent Gregory M. Howison
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@554b063c com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6f086b1f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@637450bf
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/04 ; H01L29/04 ; H01L29/66 ; H01L29/49 ; H01L29/78 ; H01L29/16 ; H01L29/786 ; H01L29/10 ; H01L29/167

Abstract:
A semiconductor device includes a semiconductor region made of a material to which conductive impurities are added, an insulating film formed on a surface of the semiconductor region, and an electroconductive gate electrode formed on the insulating film. The gate electrode is made of a material whose Fermi level is closer to a Fermi level of the semiconductor region than a Fermi level of Si in at least a portion contiguous to the insulating film.
Public/Granted literature
- US20200035798A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-01-30
Information query
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