Invention Grant
- Patent Title: Thin film transistor including high-dielectric insulating thin film and method of fabricating the same
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Application No.: US16123590Application Date: 2018-09-06
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Publication No.: US10797149B2Publication Date: 2020-10-06
- Inventor: Jae Kyeong Jeong , Ji Won Lee
- Applicant: Industry-University Cooperation Foundation Hanyang University
- Applicant Address: KR Seoul
- Assignee: Industry-University Cooperation Foundation Hanyang University
- Current Assignee: Industry-University Cooperation Foundation Hanyang University
- Current Assignee Address: KR Seoul
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5618f0fa
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/786 ; H01L29/51 ; H01L21/02 ; H01L21/445

Abstract:
Disclosed are a thin film transistor including a substrate and a gate electrode, a gate insulating film, a semiconductor layer, a source electrode, and a drain electrode formed on the substrate and a method of fabricating the thin film transistor, wherein the gate insulating film is made of a high dielectric ternary material, A2-XBXO3, wherein A is any one selected from the group consisting of aluminum, silicon, gallium, germanium, neodymium, gadolinium, vanadium, lutetium, and actinium, B is any one selected from the group consisting of yttrium, lanthanum, zirconium, hafnium, tantalum, titanium, vanadium, nickel, silicon, and ytterbium, and A is an element different from B. The gate insulating film may be formed through a solution process, and a high-quality insulating film may be obtained through heat treatment at low temperature.
Public/Granted literature
- US20190088758A1 THIN FILM TRANSISTOR INCLUDING HIGH-DIELECTRIC INSULATING THIN FILM AND METHOD OF FABRICATING THE SAME Public/Granted day:2019-03-21
Information query
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