Invention Grant
- Patent Title: Poly finger fabrication for HCI degradation improvement of ultra-low-Ron EDNMOS
-
Application No.: US16396305Application Date: 2019-04-26
-
Publication No.: US10797159B2Publication Date: 2020-10-06
- Inventor: Lin Wei , Upinder Singh , Raj Verma Purakh
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Current Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Ditthavong & Steiner P.C.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/311 ; H01L21/283 ; H01L29/78 ; H01L29/40 ; H01L27/092 ; H01L21/8238

Abstract:
Methods of forming an EDNMOS with polysilicon fingers between a gate and a nitride spacer and the resulting devices are provided. Embodiments include forming a polysilicon layer upon a GOX layer over a substrate; forming a gate and plurality of fingers and a gate and plurality of fingers through the polysilicon layer down the GOX layer; forming an oxide layer over the GOX layer and sidewalls of the gates and fingers; forming a nitride layer over the oxide layer; removing portions of the nitride and oxide layers down to the polysilicon and GOX layers to form nitride spacers; and forming S/D regions laterally separated in the substrate, each S/D region adjacent to a nitride spacer.
Public/Granted literature
- US20190252521A1 POLY FINGER FABRICATION FOR HCI DEGRADATION IMPROVEMENT OF ULTRA-LOW-RON EDNMOS Public/Granted day:2019-08-15
Information query
IPC分类: