Invention Grant
- Patent Title: Substrate, method for manufacturing substrate, and elastic wave device
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Application No.: US15638421Application Date: 2017-06-30
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Publication No.: US10797218B2Publication Date: 2020-10-06
- Inventor: Akio Kaneda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@69c9f7d8
- Main IPC: H01L41/083
- IPC: H01L41/083 ; H03H9/05 ; H05K1/03 ; H05K3/34 ; H01L41/277 ; H01L41/312 ; H03H9/02 ; H03H9/125
Abstract:
A substrate includes a substrate main body that includes a first main surface and a second main surface facing the first main surface. First electrode lands are disposed inside a recessed portion of the first main surface of the substrate main body. Second electrode lands are disposed in a region outside the recessed portion. The first electrode land and the second electrode land are connected to different electric potentials.
Public/Granted literature
- US20170309807A1 SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND ELASTIC WAVE DEVICE Public/Granted day:2017-10-26
Information query
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