Invention Grant
- Patent Title: Wire routing structure and busbar module
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Application No.: US16016531Application Date: 2018-06-22
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Publication No.: US10797294B2Publication Date: 2020-10-06
- Inventor: Yuki Hashimoto
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@76216849
- Main IPC: H01M2/30
- IPC: H01M2/30 ; H01M2/20 ; H01M2/04 ; H01M2/02 ; H01M10/48 ; H01M10/42 ; H01M2/10

Abstract:
A wire routing structure includes a case, a wire routing groove formed in the case, a first wire accommodated in the wire routing groove, a second wire one end of which a connection terminal is attached, and a hinge cover connected to the case via a hinge portion. The hinge cover includes a wire holding portion that holds the second wire. The hinge portion positions in an opposite side of the connection terminal while interposing the first wire between the hinge portion and the connection terminal, and positioned below the second wire.
Public/Granted literature
- US20190027733A1 WIRE ROUTING STRUCTURE AND BUSBAR MODULE Public/Granted day:2019-01-24
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