- Patent Title: Wafer level package with at least one integrated antenna element
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Application No.: US15857812Application Date: 2017-12-29
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Publication No.: US10797375B2Publication Date: 2020-10-06
- Inventor: Ivan Ndip , Tanja Braun
- Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Applicant Address: DE Munich
- Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Current Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Current Assignee Address: DE Munich
- Agency: Perkins Coie LLP
- Agent Michael A. Glenn
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@39e35849
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01Q1/22 ; H01L23/552 ; H01L23/498 ; H01L23/31 ; H01L23/367 ; H01Q19/06 ; H01L23/66 ; H01L23/00
Abstract:
A wafer level package with at least one integrated antenna element includes a chip layer with at least one chip, a dielectric layer as well as an antenna layer arranged between the chip layer and the dielectric layer.
Public/Granted literature
- US20180191051A1 WAFER LEVEL PACKAGE WITH AT LEAST ONE INTEGRATED ANTENNA ELEMENT Public/Granted day:2018-07-05
Information query
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